TSMC and Samsung Diverge on Advanced Processes in Race for AI Chip Foundry Leadership

TSMC and Samsung Electronics are at the center of global competition in advanced chipmaking. As AI accelerators and high-performance computing chips demand ever greater performance, power efficiency and transistor density, process nodes below 2 nanometers have become critical. The companies’ different technologies and investment timetables will influence customer orders, capacity allocation and the global semiconductor supply landscape.

TSMC is accelerating development of angstrom-era processes including A16 and 1 nanometer, with mass production scheduled to begin in stages from 2027. The push is aimed at extending its lead in AI chip foundry services. Samsung Electronics, meanwhile, has slowed its 1.4-nanometer program and is currently concentrating resources on optimizing its 2-nanometer process and improving yields. Reports did not disclose any additional investment by either company.