Amkor Weighs China Stake Sale to Accelerate AI Packaging Push

Amkor Technology, a major U.S. provider of outsourced semiconductor packaging and testing services, is reassessing its global footprint as artificial-intelligence chips drive demand for more complex packaging. Advanced packaging has become a strategic bottleneck for high-performance computing, prompting suppliers to redirect capital and production capacity toward technologies that connect processors, memory and other components more efficiently.

Amkor is considering a sale of an equity stake in its China operations, which are valued at about $1 billion to $1.5 billion, according to the latest report. No buyer, stake size or transaction timetable has been disclosed. The company is simultaneously expanding in AI advanced packaging and has reached a multiyear agreement with Nvidia valued at $1.5 billion, underscoring the shift in its investment priorities.