Broadcom Seeks Up to $100 Billion for AI Chip Buildout

The surging cost of chips, data centers and power for training artificial intelligence models is pushing technology companies toward large, asset-backed financing structures. Broadcom, Apollo Global Management and Blackstone launched the AI XPV Platform on June 9, 2026, with an initial $35 billion capital package. The structure helps Anthropic secure custom AI chips and computing capacity while limiting the capital expenditure carried directly on its balance sheet.

Broadcom is now in talks with Apollo, Blackstone and other lenders to raise more than $60 billion in debt, Bloomberg reported on August 20, 2026. The overall package could reach $100 billion and may include about $30 billion of subordinated debt alongside $60 billion to $70 billion of senior secured debt. Broadcom could provide partial guarantees, with proceeds supporting Anthropic and other companies expanding AI infrastructure built around custom silicon.