CTBC Securities Leads Mirle Bond Auction as AI Orders Rise

Mirle Automation, a Taiwan-based supplier of factory automation equipment and systems integration services, is benefiting from a global buildout in advanced packaging capacity for artificial intelligence chips and rising demand linked to humanoid robots. The resulting increase in orders has supported revenue and encouraged the company to deepen its role in global supply chains, making access to fresh financing important for expansion.

CTBC Securities is managing an auction for Mirle’s three-year unsecured convertible bonds, with bidding set to close on Aug. 25, 2026, and a minimum bid price of NT$103. The deal gives investors exposure to Mirle’s AI-related packaging and robotics growth while providing the company with funding flexibility as it handles a larger order book and broadens its international supply-chain presence.