AMD to Invest More Than $10 Billion in Taiwan AI Ecosystem, Expand Packaging and Manufacturing Capacity

AMD plans to invest more than $10 billion in Taiwan across chip manufacturing, advanced packaging and testing as it expands AI accelerator supplies and challenges Nvidia’s market position. CEO Lisa Su views Taiwan’s comprehensive semiconductor and server supply chain as an important foundation for AMD’s future growth.

AMD also announced partnerships with ASE Technology, SPIL and Powertech Technology to expand advanced packaging capacity, while working with contract-manufacturing partners Wistron, Wiwynn and Inventec to build Helios AI systems. Powered by Instinct MI450X accelerators, the systems are expected to begin deployment and shipments in the second half of 2026, generating orders for Taiwan’s packaging and server supply chains.