Advanced Packaging
+ FollowAdvanced packaging uses technologies such as CoWoS and EMIB to integrate computing chips, memory and interconnect components, improving performance, bandwidth and energy efficiency. Recent demand for AI chips has prompted TSMC to expand CoWoS capacity, with excess orders flowing to ASE and Amkor. Powertech Technology and Broadcom are also expanding in Singapore, while Intel has entered the competition with EMIB-T. Meanwhile, substrate shortages, delays to mass production of glass substrates and the pace of new architecture development could affect supply-chain capacity, costs and vendors' market shares.
Key Moments
8 selectedThe full history is split into 8 equal periods by event count, taking the most-covered story from each. Coverage rises and falls with the news cycle, so sampling period by period keeps the most recent events from taking everything.
- 2026-08-19 AI Chip Boom Fuels V5 Technologies’ Inspection Growth 3 reports
- 2026-08-11 TSMC Mass-Produces 5.5-Reticle CoWoS, Targets 14x Scale by 2029 2 reports
- 2026-08-04 Ampletec Posts Record July Revenue, Q2 Profit on AI Demand 1 report
- 2026-06-26 AMD Venice Shipments Forecast to Outpace Nvidia Vera as AI Chip Competition Intensifies 2 reports
- 4 more key moments Sign up to see the full context
Event Timeline
72 core events39 peripheral mentions — events mainly about something else
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