Advanced Packaging

Advanced packaging uses technologies such as CoWoS and EMIB to integrate computing chips, memory and interconnect components, improving performance, bandwidth and energy efficiency. Recent demand for AI chips has prompted TSMC to expand CoWoS capacity, with excess orders flowing to ASE and Amkor. Powertech Technology and Broadcom are also expanding in Singapore, while Intel has entered the competition with EMIB-T. Meanwhile, substrate shortages, delays to mass production of glass substrates and the pace of new architecture development could affect supply-chain capacity, costs and vendors' market shares.