Intel Weighs Dual-Sided Power Delivery for 14A2 in TSMC Challenge

Intel is accelerating efforts to rebuild its foundry competitiveness, with plans to challenge TSMC and Samsung using its future 14A2 process. As transistors continue to shrink, resistance, voltage drops and limited routing space in power lines are becoming performance bottlenecks. Intel’s ability to overcome these physical constraints in power delivery could determine whether it succeeds in winning advanced-node customers.

The latest reports indicate that Intel is considering a dual-sided hybrid power delivery architecture for 14A2 to address resistance and manufacturing challenges arising from line widths of about 21 nanometers. If development and yield improvements proceed smoothly, Intel expects to begin mass production in 2029, putting it in direct competition with the next generation of advanced processes from TSMC and Samsung.