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Event File AI Advanced Packaging

Taiwan Semiconductor ETF 00891 Rebalances Toward AI and Advanced Packaging Supply Chains

1 reports · First detected 2026-04-29 · Last active 2026-04-29

The CTBC Taiwan ESG Leading Semiconductor ETF (00891), managed by CTBC Investments, has nearly NT$42 billion in assets and is Taiwan’s largest semiconductor-themed ETF. As AI moves from model training to real-world deployment, it is driving demand for memory capacity, advanced processes and high-speed transmission. The portfolio changes will therefore affect investors’ exposure to the industry’s next growth cycle.

The latest regular index review will take effect on April 27, 2026. Nanya Technology, Winbond Electronics and LandMark Optoelectronics will be added, while the weightings of wet-process and advanced-packaging equipment stocks including Grand Process Technology and All Ring Tech will increase. Airoha Technology, Kinik, Sigurd Microelectronics, Sino-American Silicon Products and WPG Holdings will be removed. CTBC Investments said the domestic production rate for equipment used by Taiwanese manufacturers has risen from about 15% to 30%, with the changes centered on three themes: memory, equipment and co-packaged optics, or CPO, for silicon photonics.

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