NVIDIA, SK hynix Deepen Technology Partnership to Advance AI Factories and Next-Generation Memory
AI factories depend on high-bandwidth, energy-efficient memory, making performance and development cycles critical to scaling AI computing. Longtime partners NVIDIA and South Korea’s SK hynix are expanding their relationship beyond the supply of products such as HBM into joint design for the AI infrastructure, personal AI and physical AI markets.
NVIDIA and SK hynix announced a multiyear partnership on June 8, 2026, without disclosing its value. The companies will develop dedicated memory for the Vera Rubin AI supercomputer, Vera CPU, RTX Spark PCs and Jetson Thor platform. SK hynix will also adopt NVIDIA’s AI and digital twin technologies to accelerate chip design, manufacturing and decision-making.
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The history behind this eventSK Group, TSMC Deepen AI Chip Partnership to Develop Next-Generation HBM4 Technology
AI accelerators must transfer large volumes of data rapidly between processors and memory, making high-bandwidth memory a critical part of the AI chip supply chain. SK hynix is a major HBM supplier, while TSMC has expertise in advanced logic processes and packaging. Combining their capabilities in memory, base dies and packaging could help meet cloud providers’ demand for custom AI chips.
SK Group Chairman Chey Tae-won recently met TSMC Chairman and CEO C.C. Wei in Taipei, where they agreed to expand cooperation on HBM4 and advanced packaging. SK hynix will outsource production of its HBM4 base dies to TSMC to strengthen custom-product development. Available information does not disclose the meeting’s exact date, the value of any investment or contract, or the mass-production timetable.
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