Hoya Intelligence Targets Mid-September TPEx Listing, Expands Into CPO and Autonomous Vehicles

Hoya Intelligence develops AI-based image recognition, edge computing and machine-vision algorithms, with automated optical inspection, or AOI, for semiconductors forming a key commercial application. The company is extending that expertise into co-packaged optics, or CPO, as surging AI computing demand increases the need for faster data transmission and more advanced optical connectivity.

The company plans to list on the Taipei Exchange in mid-September while accelerating development of CPO applications, AI-powered autonomous vehicles and robotic vision systems. Hoya Intelligence aims to use its semiconductor AOI capabilities as a springboard into advanced packaging and autonomous mobility, broadening its revenue base and building a second growth engine alongside its existing smart-vision business.