Co-Packaged Optics (CPO)
+ FollowCo-packaged optics (CPO) integrates optical components with switches or computing chips in a single package, shortening electrical signal paths to increase bandwidth and reduce energy use in AI data centers. NVIDIA recently launched CPO switches, while Corning, TSMC, Intel and Largan Precision are accelerating work on glass substrates, through-glass vias and silicon photonics. Largan Precision has also secured its first order. Yield rates, costs and mass-production timelines remain challenging, making supply-chain progress and the pace of commercial deployment important areas to watch.
Key Moments
6 selectedThe full history is split into 6 equal periods by event count, taking the most-covered story from each. Coverage rises and falls with the news cycle, so sampling period by period keeps the most recent events from taking everything.
- 2026-09-02 TOYO Automation, Suruga Seiki Team Up on AI Photonics Equipment 1 report
- 2026-08-15 Nvidia Begins Mass Production of Spectrum-X Photonics Switches 2 reports
- 2026-07-06 Nvidia’s Next-Generation AI Rack Delays Open Door for AMD and Google 2 reports
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Event Timeline
42 core events21 peripheral mentions — events mainly about something else
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