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Event File AI AI Data Centers Co-Packaged Optics (CPO)

Touch Taiwan 2026 to Debut Silicon Photonics Zone Focused on AI Data Centers and CPO

1 reports · First detected 2026-03-13 · Last active 2026-03-13

Generative AI is driving up data-center traffic, while conventional electrical signaling faces power consumption, heat dissipation and distance constraints at high transmission speeds. This has made silicon photonics and co-packaged optics (CPO) critical technologies. Building on its display-technology roots, Touch Taiwan has expanded into smart manufacturing and semiconductors. The new zone reflects the Taiwanese supply chain’s accelerating push into optoelectronic integration.

Touch Taiwan 2026 has announced that its 2026 exhibition will feature a dedicated Silicon Photonics Zone for the first time, showcasing silicon photonics and CPO applications in AI data centers and high-performance computing architectures. Organizers plan to invite international companies including AMD and ASE Technology to discuss high-efficiency optical coupling, chip packaging and optoelectronic integration, highlighting the shift in AI infrastructure from electrical to optical connectivity.

All Coverage

1 original reports
TECHNEWS.TW 2026-03-13
矽光子與 CPO 新契機，Touch Taiwan 2026 首設「矽光子專區」

The Backstory

The history behind this event
Taiwanese Companies Target AI Optical Communications and Advanced Packaging at Touch Taiwan2026-04-19 · 1 reports · similarity 0.80

Generative AI is driving up data-center bandwidth and cooling requirements, prompting display supply-chain companies to seek new growth engines. Micro LED technology can be extended to high-speed optical communications, while glass offers low thermal expansion and fine-line routing. Those properties make it an important material for co-packaged optics, or CPO, and advanced packaging, spurring a transformation among Taiwan’s panel and materials companies.

Touch Taiwan 2024 highlighted the display industry’s expansion into AI infrastructure. Corning, AUO and Innolux showcased or invested in research and development involving CPO, Micro LED optical communications and through-glass via, or TGV, substrates to address changes in data-center architecture. Reports did not disclose the three companies’ investment amounts or mass-production schedules.

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