TSMC Says AI Drove Asia-Pacific Wafer Use Past Height of Three Taipei 101 Towers in 2025

TSMC said demand for computing power from generative AI is spreading from cloud data centers to edge devices including personal computers, smartphones and vehicles, boosting demand for advanced processes, advanced packaging and high-bandwidth memory. The company also outlined a roadmap for semiconductor industry output to reach $1.5 trillion, underscoring the importance of AI infrastructure to Asia-Pacific supply chains.

At its technology symposium in Taiwan, TSMC said Asia-Pacific customers used more than 2.1 million 12-inch wafers in 2025. Stacked vertically, the wafers would exceed the combined height of three Taipei 101 towers. The company said AI is expanding from the cloud to edge computing and that related demand is growing exponentially. The figures reflect the speed and scale at which regional customers are expanding AI computing capacity.