Huawei Unveils ‘Tao’s Law’ Chip Technology, Targets 1.4-Nanometer-Equivalent Performance by 2031

U.S. export controls have restricted Huawei’s access to advanced lithography equipment and chip foundry services, prompting it to seek breakthroughs beyond conventional process-node scaling. “Tao’s Law” and LogicFolding aim to increase computing density and performance through temporal scaling and logic folding. The approach could affect China’s drive for semiconductor self-sufficiency and Huawei’s ability to narrow the gap with TSMC’s advanced processes.

Huawei unveiled “Tao’s Law” in May 2026 and plans to adopt logic folding across all Kirin chips beginning in the third quarter of 2026, before extending the technology to AI and smartphone chips. It aims to deliver performance equivalent to a 1.4-nanometer process by 2031, but that refers to “equivalent performance,” not an actual geometric linewidth. Production yields, power consumption and costs have yet to be validated.