Liquid Cooling to Reach 53% of AI Chip Market in 2026

Rising power consumption from advanced AI chips designed by NVIDIA, AMD and Google is pushing heat density in rack-scale servers beyond the practical limits of conventional air cooling. Liquid cooling is consequently shifting from an optional upgrade to standard equipment for high-end AI infrastructure, making thermal management a critical constraint on computing performance, system reliability and data-center expansion. The transition also creates a growing opportunity for Taiwan’s cooling-component and server supply chains.

TrendForce expects liquid cooling to penetrate 53% of the AI chip market in 2026, meaning the technology will be used in more than half of relevant high-performance deployments. Adoption could approach 60% in 2027 as next-generation accelerators consume more power and rack-scale AI systems become more prevalent. The forecasts underscore how cooling capacity is increasingly shaping server design and infrastructure spending alongside demand for AI processors themselves.