PSMC Showcases 3D AI Foundry Strategy and Chip-Stacking Technology at COMPUTEX

Powerchip Semiconductor Manufacturing Corp. (PSMC) has positioned its “3D AI Foundry” as a contract chipmaking strategy designed to meet demand from generative AI and high-performance computing. AI chip performance is increasingly constrained by memory bandwidth and the power consumed in moving data. Tightly integrating logic and memory through 3D technology has therefore become a key approach to shortening access distances and improving computing efficiency.

PSMC recently showcased its 3D WoW (Wafer-on-Wafer) stacking technology at COMPUTEX, highlighting the integration of logic and memory chips to overcome AI memory-access bottlenecks and reduce system power consumption. Available information does not specify the exhibition date, mass-production timetable, performance gains or investment amount. The company has yet to announce further details on commercialization.