Intel Develops XBM Memory to Challenge HBM4 in AI Chip Market

Rapid growth in generative AI and high-performance computing has made high-bandwidth memory, or HBM, a critical component of AI accelerators, while also creating supply constraints and rising power consumption. Intel is therefore developing XBM, a next-generation memory architecture intended to challenge HBM4 and help the company return to the high-end DRAM market.

Intel recently disclosed patents related to XBM, which is designed to address the bandwidth, energy-efficiency and supply limitations of current HBM products. Its long-term goal is to replace HBM4. Under current plans, XBM is expected to reach the commercial market after 2030. Intel has not announced a mass-production timetable, customers or the amount invested in research and development.