TSMC Advances Silicon Photonics as AUO-Led Alliance Targets CPO Market

Demand from generative AI is pushing large processors toward the limits of conventional electrical interconnects, which face mounting constraints in bandwidth, power consumption and heat dissipation. TSMC is advancing its CoPoS and COUPE silicon-photonics technologies to integrate optical components with advanced packaging. Co-packaged optics, or CPO, is emerging as a key architecture for moving data efficiently inside next-generation AI accelerators and data centers.

AUO has joined Ennostar, Tyntek and Global Communication Semiconductors, or GCS, to form a vertically integrated CPO alliance spanning optoelectronic components, sensing technologies and compound semiconductors. The group aims to secure roles in the next wave of TSMC-linked advanced packaging demand. As of the latest report, the companies had not disclosed an investment amount, a mass-production date, customer commitments or revenue targets for the initiative.