Largan Precision Expands Into AI With TSMC CPO Collaboration, Shares Close In on NT$3,000
Largan Precision has long relied on lenses for Apple’s iPhone as the core of its business. To reduce its concentration risk in the smartphone market, the company is moving into co-packaged optics, or CPO, for AI data centers. Market reports say Largan has submitted samples to a TSMC-related platform as it develops fiber array units and optical coupling lenses. Chairman Adam Lin has stressed that these products do not constitute a complete CPO module and that commercialization will still take time.
On April 15, 2026, market reports said Largan had declined an additional Apple order for variable-aperture lenses for the iPhone 18. Its shares approached NT$3,000 intraday before closing at NT$2,820. In June, the company reported self-assessed April after-tax profit of NT$1.831 billion, up 88.5% from a year earlier. CPO-related interest drove the shares to their daily limit of NT$4,860 at one point on June 16. Lin also said Largan would establish its first automated FAU pilot production line before September.
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The history behind this eventLargan Invests Heavily in TGV and CPO to Target AI Optical Interconnect Market
As AI server computing capacity continues to expand, the power-consumption and distance constraints of copper connections are driving demand for through-glass via (TGV) technology and co-packaged optics (CPO). Largan Precision’s move into advanced optical interconnects could provide growth beyond smartphone lenses. TSMC is also working with partners including Innolux to validate glass substrates, as a next-generation packaging supply chain gradually takes shape.
As of July 20, Largan had announced plans to spend NT$650 million on laser equipment as an early investment in TGV manufacturing and had showcased next-generation CPO components as it targets high-speed transmission opportunities in AI data centers. The news lifted optical stocks, with Largan shares surging to NT$5,300 in intraday trading. TSMC also launched a glass-substrate validation program, moving the technology race into the implementation stage.
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