Micron Begins HBM4 Mass Production as Most 2026 Capacity Sells Out

High-bandwidth memory, or HBM, vertically stacks multiple layers of DRAM and directly affects AI accelerator data-transfer speeds and power consumption. Micron Technology’s entry into Nvidia’s Vera Rubin platform puts it in competition with SK hynix and Samsung Electronics for a high-value segment of the AI data-center supply chain.

Micron said on March 16, 2026, that it began mass-producing and shipping 36GB, 12-layer HBM4 in the first quarter, with most of its 2026 capacity sold out under pricing and volume agreements. On March 18, the company reported fiscal second-quarter revenue of $23.86 billion, up 196% from a year earlier, and net income of $13.785 billion. It also raised its full-year capital spending forecast to more than $25 billion.