SK Hynix Weighs Intel Foundry for HBM4E in TSMC Challenge

High-bandwidth memory, or HBM, is a critical component that gives AI accelerators rapid access to vast amounts of data, directly affecting model training and inference efficiency. SK hynix is targeting next-generation AI data centers and large-scale computing systems with HBM4E, while using MR-MUF packaging to improve cooling, performance and stability in multilayer stacks.

SK hynix recently said it had supplied 12-layer HBM4E samples to major customers but did not disclose their names, shipment dates or transaction values. The new product delivers data-transfer speeds of 16 Gbps per pin and more than 20% greater energy efficiency than its predecessor. The company hopes customer validation will accelerate adoption in next-generation AI chips.

AI accelerators must transfer large volumes of data rapidly between processors and memory, making high-bandwidth memory a critical part of the AI chip supply chain. SK hynix is a major HBM supplier, while TSMC has expertise in advanced logic processes and packaging. Combining their capabilities in memory, base dies and packaging could help meet cloud providers’ demand for custom AI chips.

SK Group Chairman Chey Tae-won recently met TSMC Chairman and CEO C.C. Wei in Taipei, where they agreed to expand cooperation on HBM4 and advanced packaging. SK hynix will outsource production of its HBM4 base dies to TSMC to strengthen custom-product development. Available information does not disclose the meeting’s exact date, the value of any investment or contract, or the mass-production timetable.

SK Hynix is a major global supplier of high-bandwidth memory (HBM). AI accelerators require 2.5D advanced packaging to integrate HBM with logic chips. The market currently relies heavily on TSMC’s CoWoS technology, but tight capacity has become a bottleneck for AI chip shipments, making a second source critical to supply-chain resilience.

As of July 20, 2026, SK Hynix was reportedly working with Intel to test EMIB, which uses embedded bridge technology to connect HBM and logic chips and reduce reliance on TSMC’s CoWoS. The companies have not disclosed the value of the partnership, the size of the test batches or a mass-production date. The project remains at the technology-validation stage.

High-bandwidth memory, or HBM, is a critical component that gives AI accelerators rapid access to data, and supply has fallen short as data centers expand worldwide. SK hynix currently controls about 60% of the HBM market and is using advanced packaging and next-generation products to strengthen its lead while competing with Samsung Electronics and Micron for orders from major cloud providers.

SK Group Chairman Chey Tae-won recently pledged to sharply increase SK hynix's HBM output and accelerate the latest HBM4 into mass production to narrow the supply-demand gap for AI chips. He said adding wafer capacity takes at least four years and that tight global supplies could persist until 2030. The reports did not disclose the investment amount for the expansion or a specific production start date.