SK Hynix Reportedly Tests Intel’s EMIB as TSMC CoWoS Capacity Tightens

High-bandwidth memory is a critical component in AI accelerators, providing the data throughput required by advanced processors. HBM4E is the next step in that product cycle, and its base logic die requires sophisticated foundry manufacturing. Adding a second supplier could help SK Hynix contain rising process costs and reduce dependence on a single manufacturing partner, while challenging TSMC’s reported exclusive position in the company’s outsourced HBM logic-die production.

SK Hynix is evaluating whether to allocate part of its HBM4E base-die production to Intel Foundry, according to the latest report, creating a dual-source arrangement alongside TSMC. As of Aug. 31, 2026, the plan remained under consideration, with no disclosed production schedule, process node, wafer volume or contract value. A deal would give Intel a foothold in the fast-growing AI memory supply chain and could weaken TSMC’s exclusive role in the program.

AI server chips must integrate compute dies, HBM and multiple other components, making advanced packaging a key area of semiconductor competition. After becoming a TSMC CoWoS partner, Powerchip Semiconductor Manufacturing Corp. (PSMC) has also entered Intel's EMIB supply chain. The move shows its business expanding beyond mature-node foundry services into the high-end packaging market.

PSMC recently became an Intel EMIB advanced-packaging partner and is also pursuing HBM-related business with Micron. Chairman Frank Huang said the company expects AI server demand to drive growth in specialty processes and plans to position itself in the market through 3D wafer stacking and integrated passive-device technologies. The partnership timetable, investment amount and mass-production scale have not been disclosed.