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Event File AI Advanced Packaging

SPIL Secures NT$50 Billion Sustainability-Linked Loan Led by CTBC Bank

1 reports · First detected 2026-08-17 · Last active 2026-08-17

Siliconware Precision Industries Co. (SPIL) is a major semiconductor assembly and testing provider, placing it at the center of the advanced-packaging supply chain for artificial intelligence accelerators and high-performance computing chips. As increasingly complex chip designs drive demand for advanced packaging, access to long-term capital is critical for capacity expansion and process development. Sustainability-linked financing also connects borrowing terms to agreed environmental or social performance targets.

CTBC Bank has led a five-year, NT$50 billion sustainability-linked syndicated loan for SPIL, bringing together 12 participating banks. The facility was oversubscribed, signaling strong lender demand despite the transaction’s large size. SPIL plans to use the proceeds to accelerate advanced-process research and expand production capacity, positioning the company to capture AI- and high-performance-computing-driven packaging demand. The financing was announced recently, although the available report did not specify an exact signing date.

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