WinWay Targets CPO Silicon Photonics Testing as AI Drives High-Speed Data Demand

AI and high-performance computing (HPC) are driving up data-center traffic, while conventional electrical signaling faces constraints in bandwidth, power consumption and transmission distance. Co-packaged optics (CPO), which integrates optical and electronic components, is emerging as a key technology for high-speed interconnects. Semiconductor test-interface specialist WinWay Technology is developing simultaneous optical and electrical testing for silicon photonics to capture opportunities from AI infrastructure upgrades.

WinWay recently showcased advanced CPO silicon photonics testing technology at an industry forum, unveiling a comprehensive suite spanning wafer-, bare-die- and module-level testing. It expects 2026 to mark the first year of CPO commercialization. The company said visibility for AI testing orders has unusually extended to six months, with supply still falling short of demand. It aims to push monthly revenue above NT$1 billion in the second half of the year.