MediaTek Recruits Former TSMC Executive Douglas Yu to Advance AI Chip Packaging

MediaTek is expanding its AI chip ambitions from edge devices to data centers. High-performance chips impose greater demands on die integration, bandwidth and thermal management, making advanced packaging technologies such as TSMC’s CoWoS a key competitive battleground. Douglas Yu, a former TSMC vice president of research and development who is regarded as a key driving force behind CoWoS, brings experience that could strengthen MediaTek’s advanced-packaging capabilities.

MediaTek recently appointed Yu as a part-time adviser to support its AI chip and data-center products with his advanced-packaging research and development expertise. The company said the appointment was unrelated to Intel’s EMIB technology. It did not disclose Yu’s advisory fee, the formal effective date of the appointment or the length of his term. MediaTek said it would continue investing in TSMC’s advanced packaging and deepen their research and development collaboration.