Lam Research Opens Panel-Level Packaging R&D Center in Austria

Lam Research, a leading global semiconductor equipment maker, acquired Salzburg-based wet-processing specialist Semsysco in 2022, gaining access to panel-handling technology the company had developed since 2012. Compared with round wafers, panel-level packaging improves area utilization and the efficiency of capacity expansion for large packages. It is particularly important for the large, heterogeneously integrated chips required for AI and high-performance computing.

Lam Research formally opened its Panel-Level Packaging Center of Excellence in Salzburg, Austria, on May 20, 2026. It is the company's first R&D facility dedicated to wet processing for square and rectangular substrates. Covering electroplating, etching and cleaning, the center supports rapid iteration, early-stage validation and joint development with customers. The company did not disclose the investment, facility size or production capacity.