ITRI, Lithuania Partner on Ultrafast Lasers for AI Chip Packaging

Surging demand for artificial intelligence computing is increasing pressure on chip performance, thermal management and manufacturing precision, making advanced packaging a strategic battleground for the semiconductor industry. Taiwan’s Industrial Technology Research Institute, or ITRI, is tapping Lithuania’s laser expertise to develop processes that can handle new materials with high accuracy and limited heat damage, while strengthening Taiwan’s semiconductor supply-chain capabilities.

ITRI signed a memorandum of understanding with Lithuanian partners during SEMICON Taiwan 2026 to introduce high-power ultrafast laser sources and integrate them with AI-based controls and high-precision modules. The collaboration will focus on advanced packaging and next-generation semiconductor processes, targeting applications including thermal management for AI servers and validation of emerging materials. No investment amount or detailed deployment timetable was disclosed in the information provided.