GMT Global, Brillink Unveil 120-Channel FAU-PIC Platform for CPO Production

Generative AI is accelerating demand for faster, more power-efficient links inside data centers as networks advance from 800G and 1.6T toward higher speeds. Silicon photonics and co-packaged optics, or CPO, are central to that shift, but aligning a fiber array unit with a photonic integrated circuit remains a difficult production step. Small positioning errors can reduce optical coupling efficiency, undermine yields and raise packaging costs, making repeatable automation critical to commercial-scale manufacturing.

GMT Global said on Aug. 25, 2026, that it had teamed up with Brillink to demonstrate a production-grade platform for automated alignment and testing of a 120-channel FAU-PIC assembly. The system combines nanometer-scale precision mechanics with an internally developed AI alignment algorithm, replacing operator-dependent adjustments with a standardized and measurable workflow. The companies are targeting CPO packaging lines as the technology moves toward volume production, but disclosed no order value or shipment timetable.