Samsung Commits Over Half of 4-Nanometer Capacity to HBM4 Base Dies

High-bandwidth memory is a critical component in artificial-intelligence accelerators, moving data rapidly between processors and memory while limiting power consumption. Samsung Electronics is seeking to leverage its rare combination of memory manufacturing and foundry operations to coordinate memory dies, custom logic base dies and advanced packaging. That vertical integration could help it respond to Nvidia’s increasingly tailored chip requirements and challenge incumbent suppliers for a larger share of the AI-memory market.

Samsung is developing a seventh-generation HBM4E product with an eight-layer stack for Nvidia’s NVHBM initiative, targeting higher transfer speeds and greater customization. Successful qualification could position the South Korean company as a key supplier for Nvidia’s next-generation Rubin Ultra AI architecture. The report did not disclose a sampling date, mass-production timetable, contract value or expected supply volume, leaving the commercial scale and timing of Samsung’s prospective role uncertain.

Samsung Electronics is working to narrow the gap with TSMC in semiconductor foundry manufacturing. The 4-nanometer node is an important mature process for high-performance computing chips such as AI accelerators, and yields directly affect costs, delivery schedules and customers’ willingness to adopt it. Crossing the 80% threshold gives Samsung a foundation to take on large orders and improve capacity utilization.

Recent developments show that Samsung’s 4-nanometer process yield has exceeded 80%, helping it secure orders from customers including U.S. AI chip company Groq. Samsung is also preparing for HBM4 mass production, aiming to combine its foundry and high-bandwidth memory strengths and return its non-memory business to profitability as early as the second half of 2026. The reports did not disclose the value of the orders.

High-bandwidth memory, or HBM, is a critical component that enables Nvidia’s AI accelerators to process vast amounts of data quickly, making supply capacity a key factor in new chip shipments. Samsung Electronics is competing with SK hynix and Micron Technology to strengthen its position in the AI hardware supply chain by increasing the share of HBM4 and upgrading its manufacturing processes.

Samsung Electronics recently announced plans to expand capacity in line with Nvidia’s next-generation AI chip launch cycle, raising HBM4 to more than half of its total HBM output. Samsung also unveiled its future technology roadmap for the first time, including plans to fully adopt an advanced 2-nanometer process for the HBM5 generation. It has yet to disclose the exact investment amount, mass-production date or scale of the additional capacity.