ASE Raises 2026 Capital Spending as AI Fuels Advanced Packaging Demand

ASE Technology Holding is the world’s largest semiconductor assembly and testing provider, and its subsidiary Siliconware Precision Industries also supplies packaging for NVIDIA AI chips. As AI accelerators increasingly integrate chiplets and high-bandwidth memory, CoWoS-like advanced packaging has become a capacity bottleneck. LEAP is therefore central to ASE’s growth and profitability in 2026 and 2027.

At an earnings briefing on April 29, 2026, ASE raised its capital expenditure plan by 20%, from the $7 billion estimated in February to $8.5 billion. Of the additional $1.5 billion, $900 million will go toward plant facilities and $600 million toward equipment. ASE also increased its LEAP revenue target from $3.2 billion to more than $3.5 billion, while maintaining its $300 million target for CoWoS-like business.