Song Sheng Technology Eyes Early-May Listing, Targets AI Advanced-Packaging CMP Pad Market

Song Sheng Technology has used its expertise in polyurethane, or PU, materials to develop its own chemical mechanical planarization, or CMP, pads for semiconductor manufacturing. It has broken into a supply market long dominated by Japanese manufacturers and joined the supply chains of major global chipmakers. As AI chips drive demand for CoWoS advanced packaging and heterogeneous integration, CMP consumables have become the company’s main growth engine.

Song Sheng Technology recently announced that it expects to list in early May at an underwriting price of NT$130 per share. The company will target the market for CMP pads used in AI advanced packaging. It aims to leverage its existing PU materials research capabilities and international customer base to expand semiconductor-consumables revenue and capture growth opportunities created by increasing CoWoS capacity.