Wet-Process Equipment Maker SYFENG Eyes Early-May TPEx Listing as AI, Advanced Packaging Demand Surges

SYFENG specializes in wet-process equipment for semiconductors and substrates and is benefiting primarily from AI and high-performance computing (HPC) demand for high-end ABF substrates and advanced packaging. As AI chip and ASIC specifications continue to advance, equipment suppliers’ technical capabilities and delivery times have become critical to capacity expansion.

SYFENG plans to list on the Taipei Exchange in early May, with order visibility now extending through the end of 2027, indicating sustained customer demand for capacity expansion. The company is also investing in research and development for through-glass vias (TGV) and fan-out panel-level packaging (FOPLP) as it seeks a place in the next-generation AI chip packaging supply chain. Available information does not disclose the underwriting price or fundraising amount.