South Korean Equipment Maker Develops X-Ray Inspection System for HBM and TGV Processes

High-bandwidth memory, or HBM, increases bandwidth by stacking multiple dies, while through-glass vias, or TGVs, are a key interconnect technology for advanced packaging and glass substrates. Both require the detection of internal defects such as bonding flaws, voids and cracks. South Korean inspection equipment maker SEC is therefore extending X-ray inspection to HBM, TGV and wafer-level packaging, or WLP, as it seeks to enter foundry and outsourced semiconductor assembly and test supply chains.

SEC has developed the Semi-Scan-SW automated inline X-ray inspection system, which can inspect HBM stacks, glass TGVs and WLP bonding processes on production lines. The company aims to expand its customer base among foundries and packaging and testing providers. As of July 20, 2026, existing reports had not disclosed a formal launch date, equipment pricing, order value, customer names or a timetable for deployment in mass production.