High-Bandwidth Memory (HBM)

High-bandwidth memory, or HBM, uses stacking and advanced packaging to improve data-transfer efficiency and is primarily deployed in AI accelerators and high-performance computing. Recent AI demand has prompted SK hynix and other companies to expand capacity and transform their businesses. Capacity bottlenecks, slowing price increases, moves by AI server makers to reduce reliance on NVIDIA, a South Korean antitrust investigation and a U.S. patent case have added uncertainty. HBM affects chip performance, demand for advanced packaging and the memory industry's business cycle, making supply, demand, competition and regulatory changes important to watch.