SK Hynix Reportedly Teams With Apple on 3D-Stacked DRAM

As generative AI moves from the cloud to smartphones and other edge devices, memory bandwidth and power consumption are emerging as critical constraints on inference performance. SK Hynix is developing a DRAM-on-Logic architecture that vertically stacks DRAM over a logic chip, aiming to overcome the bandwidth and energy limits of conventional package-on-package, or PoP, designs. The technology is viewed as a potential building block for the next generation of on-device AI memory.

SK Hynix is reportedly working with Apple to develop 3D-stacked DRAM for AI inference in mobile devices, according to the latest industry report. Neither company has formally confirmed the collaboration, and no production schedule, stack count or performance figures have been disclosed. As of July 24, 2026, attention remains focused on whether the design can deliver higher bandwidth and lower power use while meeting the cost and manufacturing requirements of high-volume consumer electronics.