AI Demand Drives High-End Solder Upgrades as Shenmao Samples Advanced Packaging Materials

Shenmao Technology is using soldering materials such as solder paste and BGA solder balls to enter the supply chains for AI servers and advanced semiconductor packaging. As high-performance computing chips raise requirements for heat dissipation, electrical conductivity and packaging reliability, upgrades to high-end soldering materials have become critical. AI-related products now account for nearly 50% of revenue, underscoring the importance of the company’s product transformation to its growth.

Shenmao has recently provided high-end solder paste samples for AI servers and BGA solder ball samples to semiconductor packaging customers, aiming to complete certification by year-end. The company has not disclosed the value of the samples. With AI server demand continuing to strengthen, Shenmao expects operating momentum in the second half of this year to be stronger than in the first half.