SPIL Breaks Ground on Douliu Plant, Targets CoWoS Capacity by 2028

Siliconware Precision Industries Co. (SPIL), a semiconductor assembly and testing unit of ASE Technology Holding, is expanding as generative AI drives demand for high-performance computing chips. Advanced packaging has become critical to integrating processors and memory at greater density. The planned Douliu, Yunlin facility will add CoWoS capabilities, strengthening the group’s capacity to serve global customers seeking advanced AI chip packaging and testing services.

SPIL recently broke ground on the new plant in Douliu, with the first phase scheduled for completion and operation in 2028. The facility will introduce CoWoS advanced packaging and serve as a key engine for the company’s next stage of AI-related growth. The additional capacity is intended to meet rising worldwide demand for packaging and testing AI accelerators and other high-performance computing semiconductors.