TSMC Earnings Preview: AI Demand Drives Paradigm Shift Toward Advanced Packaging

TSMC is the world’s leading chip foundry. Semiconductor performance gains have traditionally relied mainly on shrinking process nodes, but AI chips require more computing, memory and high-speed data-transfer components to be integrated. Advanced packaging has therefore become critical to overcoming constraints in performance, power consumption and yield, while also reshaping strategies across the equipment and materials supply chains.

TSMC is scheduled to hold its earnings call on April 16. Senior analyst Shen Wan-chun said the industry’s technological focus is shifting from process-node scaling to advanced packaging and expects 2026 to mark an inflection point for 3D-stacked SoIC and fan-out panel-level packaging, or FOPLP. The market has recently focused on stocks in the related equipment supply chain. The report did not disclose any investment amount.