ASE Breaks Ground on Third Nanzih Campus to Expand Advanced AI Packaging and Testing

AI and high-performance computing chips increasingly depend on advanced packaging and complex testing, making packaging and testing capacity a critical part of the semiconductor supply chain. ASE is therefore expanding its Nanzih base in Kaohsiung. The third campus will combine smart logistics, advanced-process testing and system validation, strengthening southern Taiwan’s semiconductor cluster and supply-chain resilience.

ASE broke ground on a new facility at its third Nanzih technology campus on March 11, 2026. The NT$17.8 billion project will include a smart logistics center and an advanced-process testing building. Completion is expected in the second quarter of 2028, with about 1,470 jobs to be created. On March 26, ASE also announced a joint construction and unit-allocation agreement with Nanzih Electronics for the K19A facility, under which ASE will receive approximately 97.26% of the property, further expanding its advanced AI packaging and testing capacity.