Tongtai Targets AI Server Boom With Advanced Packaging Equipment

Tongtai Machine & Tool Co., traditionally a machine-tool and printed-circuit-board equipment supplier, is expanding into wafer grinding, silicon-carbide processing and advanced packaging as artificial-intelligence infrastructure reshapes electronics manufacturing. Demand from AI servers and data centers is shifting orders from handset boards toward thicker, higher-end boards, while increasingly complex packages require tighter control of drilling, planarization and heat. The move gives Tongtai a potential growth engine beyond its more cyclical legacy businesses.

At SEMICON Taiwan 2026 on Sept. 2, Tongtai said it had secured an order from a major Taiwanese packaging and testing company for laser equipment used to drill epoxy molding compound, or EMC, with expanded shipments expected in 2027. Two planarization machines for copper-pillar processing have already shipped. Electronics and semiconductor work accounted for 40% of orders at Tongtai’s Luzhu plant in the first eight months of 2026, while related orders are forecast to double from last year’s low base. The company did not disclose the contract value.