Kyocera Unveils Multilayer Ceramic Core Substrate to Boost Advanced AI Chip Packaging

Japan's Kyocera is targeting demand for advanced packaging of AI chips such as xPUs and ASICs. As chip packages grow larger, conventional organic core substrates are prone to warping, potentially disrupting fine-pitch interconnections and reducing packaging yields. The new multilayer ceramic core substrate uses high rigidity and dimensional stability to support high-density, fine-pitch 3D wiring, a capability critical to the performance and reliability of next-generation AI computing.

Kyocera said the multilayer ceramic core substrate is scheduled to make its formal debut in 2026. It is primarily intended for large xPU and ASIC packages used in high-performance AI computing. The company has not yet disclosed an exact launch date, investment amount, pricing, customer list or mass-production timetable. The technical details released so far focus on using a ceramic core to curb substrate warping and improve the stability of advanced packaging.