Besi Q2 Orders Double to Record on AI Packaging Demand

BE Semiconductor Industries, known as Besi, supplies advanced semiconductor assembly and packaging equipment, including systems used in hybrid bonding. The Dutch company is positioned to benefit as chipmakers expand capacity for artificial-intelligence processors, which require increasingly complex packaging to combine high-performance computing and memory components. The investment wave has made advanced packaging a critical bottleneck in the AI supply chain.

Besi reported second-quarter 2026 orders of 292.9 million euros, double the year-earlier level and the highest in its history, as AI-related demand boosted bookings for high-end equipment. The company said third-quarter revenue should continue to grow. Still, the outlook fell short of elevated market expectations, sending its shares down more than 7% after the results were released in July.