AI Chip Boom Fuels V5 Technologies’ Inspection Growth
Artificial-intelligence accelerators and high-bandwidth memory are driving demand for advanced packaging as chipmakers seek more computing power without relying solely on smaller process nodes. Taiwan Semiconductor Manufacturing Co.’s CoWoS expansion is raising the value and complexity of each packaged device, pushing quality control from end-of-line sampling toward checks at multiple production stages. That shift gives inspection and metrology suppliers such as V5 Technologies a more durable source of equipment demand.
V5 Technologies told an investor conference on Aug. 19 that first-half 2026 revenue rose 91.5% to NT$1.419 billion, while net income increased 104% to NT$442 million. Earnings per share reached a record NT$10.12. Chairman Lin Kun-hsi said revenue should keep rising month by month in the second half, with order visibility extending into the third quarter of 2027. The company has secured four inspection stations for CoPoS, versus two for CoWoS, and estimates mature capacity requires eight to 12 machines per 10,000 wafers a month.
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The history behind this eventAI Chips Fuel Advanced Packaging and Optical Inspection Demand as Taiwan Suppliers Challenge Foreign Dominance
AI chips are expensive to manufacture, while advanced packaging combines multiple dies, meaning any defect can reduce the yield and value of an entire package. Inspection is therefore shifting from sampling to checking every chip. TSMC’s expansion of CoWoS capacity is also increasing demand for automated optical inspection, or AOI, creating opportunities for Taiwanese equipment makers to enter the high-end supply chain.
The latest developments show that TSMC’s CoWoS expansion has driven orders and qualification demand for optical inspection equipment. Taiwanese AOI suppliers have secured positions in the market, gradually challenging the long-standing dominance of U.S. vendors. Reports did not disclose the suppliers’ names, investment amounts, capacity figures or exact dates, but the near-zero-defect requirements for AI chips are making 100% inspection an important trend in advanced packaging.
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