ASE Develops Automated 310mm Panel-Level Packaging Line for AI and HPC Demand

Generative AI is driving steep increases in computing and data-transfer demand, exposing constraints in power consumption, bandwidth and thermal management. ASE Technology Holding sees advanced packaging as central to sustaining AI hardware performance. Its strategy uses heterogeneous Chiplet integration to combine dies made with different processes and functions in a single package, improving system efficiency, interconnect density and design flexibility.

ASE’s latest advanced-packaging roadmap focuses on its VIPack platform, an automated panel-level packaging production line and silicon photonics, including co-packaged optics, or CPO. The technologies are intended to ease interconnect and power bottlenecks in high-performance AI systems. ASE also called for broader collaboration across the global semiconductor ecosystem, but did not disclose an investment amount, a production start date, customer commitments or a detailed commercialization timetable.