TOYO Automation, Suruga Seiki Team Up on AI Photonics Equipment

Co-packaged optics, or CPO, places optical components closer to computing chips, shortening electrical signal paths to reduce power consumption and latency while increasing data throughput. The technology is becoming increasingly important as generative AI drives demand for faster, more energy-efficient links within servers and data centers. Precision optical-coupling alignment systems are a critical production tool for silicon photonics and advanced semiconductor packaging.

Taiwanese automation-equipment maker TOYO Automation has partnered with Japan’s Suruga Seiki to develop a next-generation CPO optical-coupling alignment platform targeting advanced packaging and AI server supply chains. The companies expect mass-production demand to accelerate in the first half of 2027, though they disclosed neither an investment amount nor a firm production date. They are also expanding into key robotic components as AI investment fuels broader factory-automation demand.