Semiconductor Analyst Sees AI Rally Running for at Least Three More Years

Generative AI is driving continued data-center expansion, raising questions about how long the semiconductor upcycle can last. Rather than GPU demand alone, capacity and supply constraints in Advanced Packaging and high-bandwidth memory (HBM) have a more direct impact on AI chip shipments and are key indicators for industry investment.

Semiconductor analyst Bubble Boi recently said the AI investment cycle remains in its early stages and that the related market rally is expected to continue for at least another three years. He said the real bottlenecks at this stage are Advanced Packaging and HBM, not end demand. Reports did not specify when the comments were published, his affiliated institution or any investment amount.