LCY Advanced Materials Unveils Wet-Chemistry Solution for AI Chip Packaging

Demand for artificial intelligence chips and high-bandwidth memory is pushing advanced packaging toward denser, smaller interconnects. That shift makes etching and cleaning increasingly difficult, particularly in narrow gaps where residues can undermine electrical performance and manufacturing yields. Wet-chemistry processes that combine precision, cleanliness and material compatibility are therefore becoming critical to the reliable mass production of next-generation AI and HBM packages.

LCY Advanced Materials unveiled a wet-chemistry solution for high-density interconnects at SEMICON Taiwan, featuring multifunctional etchants and cleaning technology for fine structures. The company said the process overcame the 10-micrometer interconnect threshold and raised manufacturing yield to 99%. The offering targets shrinking geometries and persistent micro-gap cleaning challenges in advanced packaging used for AI processors and HBM devices.