Taiwan Targets Trillion-Dollar AI Market With Advanced Packaging, Power Tech

The rapid expansion of generative AI and high-performance computing is increasing demand for faster chip interconnections, advanced packaging and more efficient data-center power systems. Taiwan’s Department of Industrial Technology under the Ministry of Economic Affairs is working with 山太士, Tong Hsing Electronic Industries and the Industrial Technology Research Institute to build local capabilities spanning materials, semiconductor packaging and power conversion.

The partners are advancing square glass substrates, co-packaged optics, or CPO, and solid-state transformers, known as SSTs, to address bandwidth, heat and energy bottlenecks in AI infrastructure. Their materials and manufacturing initiatives are aimed at positioning Taiwan’s semiconductor supply chain for a green-computing market projected to reach several trillion New Taiwan dollars by 2030, as power-intensive AI systems move toward commercial deployment.