SK Hynix, Intel Seen Exploring Ohio AI Chip Partnership
Intel's Ohio fab project sits at the center of Washington's effort to rebuild domestic semiconductor manufacturing and secure the supply chain for artificial-intelligence hardware. SK Hynix is a leading supplier of high-bandwidth memory, a critical component in AI accelerators. With US officials pressing chipmakers to expand local investment, the companies have a strategic fit: Intel brings logic-chip manufacturing and packaging capacity, while SK Hynix contributes advanced memory technology, making any Ohio partnership relevant to the broader race for AI infrastructure.
South Korean media recently reported that SK Hynix was considering acquiring Intel's Ohio wafer-fabrication plant, a claim the memory maker denied. Analysts nevertheless see strong incentives for the companies to cooperate through a joint venture or by integrating advanced packaging with memory and logic production. As of July 22, 2026, neither company had announced a binding agreement, purchase price or timetable. The latest information therefore points to potential collaboration rather than a confirmed sale of Intel's Ohio assets.
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The history behind this eventSK Hynix Reportedly Tests Intel’s EMIB as TSMC CoWoS Capacity Tightens
SK Hynix is a major global supplier of high-bandwidth memory (HBM). AI accelerators require 2.5D advanced packaging to integrate HBM with logic chips. The market currently relies heavily on TSMC’s CoWoS technology, but tight capacity has become a bottleneck for AI chip shipments, making a second source critical to supply-chain resilience.
As of July 20, 2026, SK Hynix was reportedly working with Intel to test EMIB, which uses embedded bridge technology to connect HBM and logic chips and reduce reliance on TSMC’s CoWoS. The companies have not disclosed the value of the partnership, the size of the test batches or a mass-production date. The project remains at the technology-validation stage.
SK Hynix, Intel Explore U.S. Memory-Chip Venture
SK Hynix is a leading supplier of high-bandwidth memory, or HBM, used in artificial-intelligence accelerators. Surging investment in AI data centers has tightened memory supplies, while Washington is pressing chipmakers to localize production and reduce tariff exposure. SK Hynix is already investing more than $4 billion in an advanced HBM packaging plant in Indiana, due to begin mass production in the second half of 2029, but it does not currently fabricate memory wafers in the United States.
Reuters reported on Sept. 16, 2026, citing three people familiar with the discussions, that SK Hynix and Intel were in preliminary talks. Options include leasing part of Intel’s long-planned Ohio manufacturing complex or forming a joint venture with Intel and major cloud providers seeking secure memory supplies. The chip type and deal value remain undetermined. SK Hynix said no decision had been made, while South Korea’s Ministry of Trade, Industry and Energy said any transfer of national core technology would require review.
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